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There are some bright spots, however. For example, the Gigabit Ethernet market is making a rapid transition from the enterprise to the high-volume desktop market–a move that spur demand for LAN cards and chips, he said. Intel is one of the world's leading suppliers of LAN cards and chips, it was noted.

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There are some bright spots, however. For example, the Gigabit Ethernet market is making a rapid transition from the enterprise to the high-volume desktop market–a move that spur demand for LAN cards and chips, he said. Intel is one of the world's leading suppliers of LAN cards and chips, it was noted.

SANTA CLARA, Calif.–As predicted earlier this year, Intel Corp. today announced it has completed first production of microprocessors on 300-mm diameter wafers using a 0.13-micron process technology.

Intel claimed it is the first chip maker to produce and ship production level processors” on 0.13-micron technology using 300-mm (12-inch) silicon substrates. Last month, Intel's chief financial officer told financial analysts that the company expected to begin shipping its first products made on 300-mm wafers in the first quarter of 2002 (see Jan. 16 story).

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Intel said the first 300-mm production wafers were fabricated at its Fab D1C facility in Hillsboro, Ore. That facility is also Intel's fifth wafer fab to begin processing ICs with 0.13-micron technology–the other four are using 200-mm (8-inch) wafers.

Less than a handful of chip companies have been in early production with 300-mm wafers, but those applications have been in memories or logic-based ICs made with 0.18- or 0.15-micron design rules. Several other chip makers have been planning 300-mm production but cutbacks in investments during the current downturn have postponed new fabs.

Intel is the first manufacturer to ramp up production of 0.13-micron technology on 300 mm wafers,” stated Sunlin Chou, senior vice president and general manager of Intel's Technology and Manufacturing Group. Microprocessors produced on 300-mm wafers cost 30% less than those made using the smaller 200-mm wafers, and by combining the larger wafers with our advanced 0.13-micron process, we are able to quadruple the output per wafer compared to that of the prior process generation,” he said.

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In addition to packing more chips on a larger diameter wafer, 300-mm manufacturing will use 40% less energy and water per IC than a 200-mm wafer factory, according to Intel.

Intel did not release information on the performance of the first central processors produced on 300-mm.

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SAN FRANCISCO — Intel Corp.'s top executive here today gave a vote of confidence for the future of the IC business in spite of the current downturn, but he urged chip makers and systems houses to continue investing and innovating in order to keep the struggling industry healthy.

The semiconductor industry is still in the midst of its worst downturn, in which worldwide chip sales fell a staggering 35% in 2001 over 2000, noted Craig Barrett, chief executive of Intel.

To bring packet relay capabilities to this network, a network must go through the following steps:

During the entire session all packets will be counted and number of bytes will be totaled.

In this relatively simple example, packet relay closes the direct link from the Ethernet hardware assist directly mapped to the frame relay assist through the HDLC controllers that are mapped to the T1 interface, thereby completing the direct link between the two networks. Other packet relay actions could include a prioritization of packets based on subscriber service levels, or the copying of packets for billing or surveillance activities.

About the Author Rob Macleod is director of product line management in the New Public Networks Group at Brooktrout Technology. Rob holds a BSEE from Worchester Polytechnic and can be reached at .

FREMONT, Calif. — In a move to spin off mature chip-fabrication tools, Mattson Technology Inc. today announced it will sell its AG Associates rapid-thermal processing (RTP) product line to Metron Technology N.V., a supplier of wafer fab support and maintenance services based in Burlingame, Calif.

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