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The second, and somewhat more likely, scenario would be that Micron is interested in Qimonda's technology. In this case, the chances to maintain the Munich and Dresden activities are higher.

BBY5303WE6327HTSA1_Datasheet PDF

The second, and somewhat more likely, scenario would be that Micron is interested in Qimonda's technology. In this case, the chances to maintain the Munich and Dresden activities are higher.

Working with Tessera Technologies Inc., Cadence (San Jose, Calif.) said it has integrated a new capability called custom lithographic source illumination into its source mask optimization software. The technology also was integrated into Cadence's resolution enhancement technology (RET) design flow.

Chip manufacturing at 22 nm is not expected to begin before 2011. At 22-nm and lower manufacturing nodes, existing RETs will not provide required IC pattern fidelity. Cadence claims its source mask optimization technology delivers more accurate lithography to provide chip pattern fidelity and increased manufacturing yields.

BBY5303WE6327HTSA1_Datasheet PDF

The company further claims the new capability enhances lithographic souce illumination based on the ability to print 2-D layout structures through a process window,” rather than only through the critical dimensions of a design.

We're going beyond” design-for-manufacturing,” Dipu Pramanik, vice president of silicon signoff and optimization at Cadence, said in a statement announcing the design capability.

San Jose, Calif. & Eindhoven, Netherlands—NXP Semiconductors has expanded its series of microcontrollers based on the ARM968 core.

BBY5303WE6327HTSA1_Datasheet PDF

At 125 MHz, the LPC2900 series is said to be the fastest flash ARM-based microcontrollers available on the market, targeting industrial networking, alarm systems and motor control applications. The latest series builds on its existing LPC291x series, but offers up to 768 KB of on-chip high-speed flash.

The LPC2900 series comes with an ARM968E-S industry standard RISC core operating at 125 MHz and provides high performance (1.1MIPS/MHz) with low power consumption. Additional features include full speed USB2.0 Host/On-The-Go/Device, dual CAN interfaces and two LIN masters, 16 KB true EEPROM, standard serial buses, plus a sophisticated PWM and two 3V and one 5V A/D converter. The family comes with up to 768 KB embedded flash memory and up to 120 KB SRAM.

BBY5303WE6327HTSA1_Datasheet PDF

Pricing: Ranges from $4.99 to $7.99 in 10K volumes.Availability: October.

NXP Semiconductors, www.nxp.com

What the SoC targets is widespread wireless churn based on poor coverage in homes and buildings. Approximately 70% of traffic is indoors, yet at 2.5GHz, a significant attenuation loss occurs through exterior walls. The frequencies for WiMAX and other 4G technologies are much higher, resulting in even more loss. Capacity is also growing–Internet traffic is doubling every 12-15 months even on mobile devices and IP TV and media downloads are consuming substantial bandwidth. High speed demand is great. The challenge is that at the micro base station, as signals go through an exterior wall, they operate at a lower modulation rate which effectively means lower bandwidth for everyone. Small base stations can actually add capacity to take on some of the burden and improve the voice and data results.

The SoC can be designed into femto base stations for indoor applications; into pico stations for indoor or outdoor applications by service providers or enterprise networks; and into micro base stations for outdoor use by service providers.

The Fujitsu solution incorporates all PHY and MAC features, analog and digital radio control, and analog circuits required to conform to Wave 2. A dual-integrated ARM core at up to 360MHz provides the processing power at a femto base station. For larger platforms, an additional processor can be connected by means of a PCI host interface to handle demands for more throughput and a bigger user base.

The SoC provides a 10/100/1000 Ethernet interface, along with a DDR-II and flash memory interface and a full range of peripherals including UART, DMAC, timer, GPIO, SPI, I2C, low-speed ADC/DACs and a network synchronization interface. The power requirements are approximately 2W, typically enabling a full femto base station to operate on less than 10W.

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