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Nvidia-Chef Jen-Hsun Huang verriet einige Architektur-Details des RSX-Chips: Bei dem Grafik-Prozessor handele es sich um ein Einchip-Design mit 300 Millionen Transistoren und 32 Shading-Pipelines. Dank einer 128-Bit-Fließkomma-Einheit schaffe der RSX zudem 136 Pixel-Shader-Operationen pro Taktzyklus.

VE-B1R-CX_Datasheet PDF

Nvidia-Chef Jen-Hsun Huang verriet einige Architektur-Details des RSX-Chips: Bei dem Grafik-Prozessor handele es sich um ein Einchip-Design mit 300 Millionen Transistoren und 32 Shading-Pipelines. Dank einer 128-Bit-Fließkomma-Einheit schaffe der RSX zudem 136 Pixel-Shader-Operationen pro Taktzyklus.

NEC Electronics has invested about 80 billion yen (about $742 million) on the 300-mm fab in the last fiscal year and plans to add another 50 billion yen (about $464 million) in this fiscal year.

PLAINVIEW &#151 Der Tester-Produzent Aeroflex Inc. übernimmt die Test & Measurement Division SPG des 3G-Mobilfunk-Spezialisten Ubinetics. Von der Maßnahme erwartet sich Aeroflex eine erhebliche Aufwertung seines Produktspektrums.

VE-B1R-CX_Datasheet PDF

Für die Übernahme der Testaktivitäten des Technologiehauses Ubinetics zahlt Aeroflex 81 Millionen Dollar. SPG mit Sitz im englischen Melbourn gilt als eines der führenden Technologiehäuser für die Entwicklung, Fertigung und Integration von Systemen für die Prüfung und Messung funktechnischer Produkte. Zielgruppe für SPG sind Unternehmen aus den Bereichen kommerzielle Funkgeräteentwicklung und Bereitstellung entsprechender Dienste. Dabei setzt SPG zwei funktechnische Schwerpunkte: Infrastrukturprüfung und Handy-Funktionstests.

Mit der Übernahme von SPG gelangt Aereoflex in den Besitz von Test-Technik für globale Mobilfunkstandards sowie für die Emulation von Endgeräten sowie von Software für die Lastanalyse. Die Systeme sind für die Forschung und Entwicklung von Handys und Infrastrukturprodukten sowie für die Optimierung von Funknetzen bestimmt.

SPG hatte zuletzt einen Jahresumsatz von 34 Millionen Dollar erzielt. Aeroflex erwartet von der Übernahme signifikante betriebliche Synergiewirkungen”. Die übernommenen funkprüf- und messtechnischen Produkte sollen das Aeroflex-Produktspektrum aufwerten.

VE-B1R-CX_Datasheet PDF

TAIPEI, Taiwan — A consortium of Chinese banks has agreed to loan $600 million to Shanghai-based foundry Semiconductor Manufacturing International Corp. to allow the company to expand its 300-mm wafer operations in Beijing.

The deal comes about three months after the U.S. Export-Import Bank, a U.S. government agency that promotes exports, declined a request from SMIC for a loan guarantee to international banks willing to lend $769 million that would have been used to buy chip-making equipment, mainly from Applied Materials Inc.

VE-B1R-CX_Datasheet PDF

Some U.S. semiconductor makers, particularly Micron Technology Inc. (Boise, Idaho), disapproved of the U.S. bank guaranteeing a loan for a foreign competitor, while the U.S.-Taiwan Business Council was supportive of the loan, believing that it promoted the health of the U.S. equipment industry.

Rebuffed, SMIC threatened to buy equipment from non-U.S. suppliers and turned to Chinese banks, which had already provided $285 million in 2004 to support the company's growth plans. In a statement Thursday (May 26), SMIC chief executive Richard Chang said the foundry would pay for future expansion with cash on hand or additional loans.

Boise, Idaho— Micron Technology, Inc., today launched a family of Mobile DDR devices, with product samples of multiple densities now available. Micron's Mobile DDR product family boasts a new architecture with Endur-IC technology specifically designed for mobile systems, and an enhanced feature set that delivers aggressive power specifications, superior bandwidth performance, and increased reliability over standard DRAM.Micron's Mobile DDR products exceed the current Joint Electron Device Engineering Council (JEDEC) standard and provide leading performance with shorter latency, higher speeds, full page burst, multiple addressing options, and according to leading customers, the industry's lowest standby current. Micron leverages its stacked DRAM process technology to achieve the complete industrial temperature range, -40-degrees Celsius to +85-degrees Celsius.

There are numerous features derived from Micron's new architecture that translate to system performance benefits for our customers, especially those customers requiring thin die specifications,” said Deb Matus, Micron's Product Marketing Manager for Mobile Memory. Micron's Mobile DDR parts demonstrate great immunity to failures arising during the manufacturing and packaging processes, making them the ideal device for die-based applications, multichip packages (MCPs), systems-in-a-package (SiPs), Package on Package (PoP) and other stacked solutions. Additionally, mobile phone manufacturers benefit from the extended battery life in standby mode given our Endur-IC technology.”

As an innovative technology from Micron, Endur-IC technology is designed to address the rugged demands of the mobile market. Endur-IC technology, a combination of Micron's advanced process technology and a unique implementation of other design methodologies, provides distinct advantages to our customers in terms of low power, high quality, high reliability, and overall robustness.

Micron developed the enhanced features of this new product family to target growing mobile applications, such as; feature-rich smart phones, digital still cameras, and MP3 players by incorporating advanced processes, including Endur-IC technology. Endur-IC technology allows for a reduction of refresh current in many applications, which leads to extended battery life in standby mode. Customers also benefit from temperature compensated self refresh (TCSR) that automatically adjusts refresh according to temperature changes in the device. For further power savings, the partial array self refresh (PASR) feature allows user control of refresh conditions to extend battery life. All of these features are available to customers without requiring special software or coding, while at the same time providing compatibility with many other suppliers' parts.

Understanding the unique memory specifications and packaging requirements of our mobile system customers, Micron developed a DRAM architecture optimized for this market segment,” said Achim Hill, Micron's Senior Director of Marketing for Mobile Memory. Achieving high speed performance, low latency and suitability for various stacking options without negatively impacting device quality and reliability were specifically emphasized in this major design thrust. And, to facilitate the design-in process with handset OEMs, we are working with leading mobile processor manufacturers to ensure compatibility between our 512Mb Mobile DDR memory and their respective devices. With the expansion of Micron's mobile product offering, we now provide industry leading volatile memory solutions with both Mobile DDR as well as our proven CellularRAM products.”

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