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Some production will never leave the West,” said Daniel Pfeifer, global R&D manager at Escatec. What we do in Switzerland is make higher value, high-mix and low-volume products that are critical to the customer's operations. There are some products that we make here that the customer won't let us ship even to the United States.”

MAX4435EUK+T_Datasheet PDF

Some production will never leave the West,” said Daniel Pfeifer, global R&D manager at Escatec. What we do in Switzerland is make higher value, high-mix and low-volume products that are critical to the customer's operations. There are some products that we make here that the customer won't let us ship even to the United States.”

Recently published industry data by The Linley Group revealed that CEVA continued to dominate the DSP IP shipments market in 2011, with shipments of CEVA-powered DSP chips surpassing that of any other DSP IP licensing company by more than a factor of 3x.

CEVA's industry-leading DSP cores and platforms power many of the world's leading semiconductor companies and OEMs, enabling unrivaled power consumption, performance and cost efficiencies for a wide range of end markets. The CEVA-TeakLite DSP family is the most successful licensable DSP family in the history of the semiconductor industry, with more than 3 billion chips shipped, over 100 design wins, 30 active ecosystem partners and more than 100 audio and voice codecs and software applications available.

MAX4435EUK+T_Datasheet PDF

The CEVA-XC family of DSPs is designed specifically to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance multimode baseband solutions. It supports multiple air interfaces for various applications such multimode cellular baseband (2G/3G/4G), connectivity (WiFi 802.11ac, GNSS), digital broadcast (DVB-T2, DVB-S2, ATSC) and smart grid.

For imaging and vision applications, the CEVA-MM3101 is a unique, fully programmable platform that is dedicated to addressing the extreme computational needs of any image enhancement or vision use case. By off-loading the device’s main CPU and replacing multiple hardwired accelerators for performance-intensive imaging and vision processing tasks, the highly-efficient CEVA-MM3101 dramatically reduces the power consumption of the overall system, while providing complete flexibility in terms of standards, imaging functions, and vision applications.

Visit www.ceva-dsp.com/DSP-Cores.html to learn more about CEVA DSP and platforms.

MAX4435EUK+T_Datasheet PDF

If you found this article to be interest, visit Microcontroller / MCU Designline where – in addition to my Max’s Cool Beans blogs on all sorts of stuff” – you will find the latest and greatest design, technology, product, and news articles with regard to all aspects of designing and using microcontrollers.

Also, you can obtain a highlights update delivered directly to your inbox by signing up for my weekly newsletter – just Click Here to request this newsletter using the Manage Newsletters tab (if you aren't already a member you'll be asked to register, but it's free and painless so don't let that stop you [grin]).

MAX4435EUK+T_Datasheet PDF

Last but certainly not least, make sure you check out all of the discussions and other information resources at All Programmable Planet. For example, in addition to blogs by yours truly, microcontroller expert Duane Benson is learning how to use FPGAs to augment (sometimes replace) the MCUs in his robot (and other) projects.

PARIS – STMicroelectronics' LBP01 series of bypass switches can be connected in parallel with one or two LEDs. It is meant to allow the current to flow through the other LEDs in case of failure.

The FinFET process will have the same leakage power characteristics as the 20-nm process on which it is based. But it will offer a performance boost up to 35 percent and total power consumption reductions up to 35 percent compared to 20 nm, said Hou.

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ARM showed foils suggesting it could tape out a V8 test processor in 2013 and see customers tape out production 64-bit ARM chips in 2015 and beyond. We want to co-optimize the process and the processor and solve some of the problems before they come up for our customers,” said Simon Segars, general manager of ARM’s processor and physical IP group in a keynote here.

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