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Floating-body tech tapped for future DRAM

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Floating-body tech tapped for future DRAM

This year's exhibition in Taipei, Taiwan, was dominated by a range of new netbooks, many based on Intel Corp.'s Atom processor. But we also found a few ARM-based netbooks, including one manufactured by a Chinese OEM.

We catalogued a range of new netbooks and other gadgets in our Computex 2009 slideshow.

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LONDON — Foundry chip supplier Taiwan Semiconductor Manufacturing Co. Ltd. has not yet committed itself to extreme ultraviolet lithography (EUVL) as the next means of making integrated circuits. The company is still backing two horses in the race to the next lithography, EUVL and clustered electron-beam.

Jack Sun, vice president of R&D at TSMC, revealed some details of progress while speaking at the IMEC Technology Forum in Brussels last week.

The main theme of Sun's talk was the need for cooperation and collaboration in the supply chain, but under that he put up some slides discussing the challenge of overcoming lithography cost hurdles and it is clear that the idea that future lithography machines could cost $40 million or $60 million each is a concern to TSMC.

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TSMC will push for cost-effective lithography,” said Sun as he proposed the possibility that clustered direct-write e-beam lithography could approach 100 wafers per hour throughput, a benchmark of industrial production using optical lithography.

TSMC is currently investigating both EUV litho with ASML Holding NV (Veldhoven, The Netherlands) and e-beam lithography with Mapper Lithography BV (Delft, The Netherlands). ASML has an EUV advanced development tool installed at IMEC (Leuven, Belgium) while Mapper is delivering a 300-mm maskless e-beam lithography platform to CEA-Leti in Grenoble.

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Apparently showing a little of bit of the carrot and the stick to leading EUV lithography equipment developer. Sun said: We welcome proposals in EUV to move from 0.25 NA [numerical aperture] to 0.35 NA and take throughput to 100 wafers per hour.” ASML is said to have five orders for its first pre-production EUV tool the NXE 3100 and TSMC along with Intel is expected to be among the recipients.

But Sun also listed some of the challenges remaining; EUV source power, mask making and mask integrity and defect inspection. And he went on to present slides detailing how Mapper's technology could provide for 13,000 individual beams in a chamber to expose an IC masklessly at a rate of 10 wafers per hour and the possibility of clustering ten such machines together to achieve 100 wafers per hour.

To complete its product range for MA motion sensors, Panasonic Electric Works has added an even more compact sensor to its existing portfolio.

With surface fitting dimensions of just 20.0 x 10.0mm and a height of 12.7mm, this sensor is approximately 35% smaller than previous models. Detection ranges of 50, 100 and 150mm as well as NPN and PNP open collector outputs are available. Of course, existing features have not been compromised, and the user can still choose between an internal or external trigger.

The combination of size and performance makes this sensor attractive for a wide range of applications, including sanitary devices such as automatically activated water faucets and hand dryers, and medical equipment, e.g. examination tables.

Finally, MA motion sensors are subjected to Panasonic’s rigorous guidelines and tests for quality, ensuring long life, reliability and top performance.

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