Santa Clara, Calif. — The PM7819 PALADIN waveshapper performs digital multi-carrier combining in transmitter subsystems for 3G wireless infrastructure designs. Specifically, the IC handles complex signal aggregation, digital upconversion, baseband filtering, and advanced crest factor reduction. Developed in a 0.18-micron process, the waveform processor delivers a 2.6-W power dissipation figure, a 92.16 MHz operating frequency, and 1.5 million gates.

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Santa Clara, Calif. — The PM7819 PALADIN waveshapper performs digital multi-carrier combining in transmitter subsystems for 3G wireless infrastructure designs. Specifically, the IC handles complex signal aggregation, digital upconversion, baseband filtering, and advanced crest factor reduction. Developed in a 0.18-micron process, the waveform processor delivers a 2.6-W power dissipation figure, a 92.16 MHz operating frequency, and 1.5 million gates.

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