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As an element of the DesignWare Sonic Focus IP solution, Sonic Focus Studio Product Mastering tool, provides:

ERJ-PA2D4320X_Datasheet PDF

As an element of the DesignWare Sonic Focus IP solution, Sonic Focus Studio Product Mastering tool, provides:

The Information Network (New Tripoli, PA) estimates that more than 54 million tablets will sell in 2011, each containing an SSD instead of HDD. The HDD market, already reeling from more than 17 million media tablets sold in 2010, will be impacted by the displacement of HDD-based notebook PCs by media tablets, the firm concluded.

The display market disruption is to be expected thanks to the revolutionary impact of the iPad, according to IHS. The tablet form factor was once was dismissed by pundits as passing fancy and earlier models failed to garner interest among consumers, but the iPad changed everything, IHS said, and will result in tablets becoming standard equipment for virtually any application, including education, healthcare, government, military, retail sales and consumers' living rooms.   IHS also forecasts that 2011 will bring a breakthrough in the manufacturing of active-matrix organic light emitting diode (AMOLED) displays. Massive investments in new materials, processes and production capacity will enable Samsung—currently the only major supplier of AMOLEDs—as well as LG and perhaps one or two other display companies to drive AMOLED penetration deeper into mobile devices, the firm predicted. This may also be the year when premium AMOLED televisions move beyond trade shows and onto retail shelves, according to the firm.

ERJ-PA2D4320X_Datasheet PDF

Another notable trend in 2011 will be the emergence of 3-D capability as a standard feature for higher-end televisions, according to IHS. Despite the buzz generated by 3-D in 2010, the systems were plagued by poor performance and a lack of content. But 3-D capability will be added to the checklist for many high-end TVs in 2011, according to IHS iSuppli. While this may lead to some near-term success, these brands may be risking long-term customer loyalty, especially if early adopters learn in a year or two that their investment is obsolete because vastly improved technology has been released, such as glasses-free 3-D or projected 3-D, the firm said.

SAN JOSE, Calif. – Japan's Toppan Printing Co. Ltd. has extended a joint development agreement with IBM for a leading-edge photomask process, covering the 14-nm technology node for logic devices. The firms will extend 193-nm immersion lithography for that node, it was noted.

The development work will take place at IBM’s photomask facility in Essex Junction, Vt., and Toppan’s Asaka photomask facility in Niiza, Saitama, Japan, from January 2011 through 2012.

ERJ-PA2D4320X_Datasheet PDF

''Several new technologies including extreme ultraviolet (EUV) have been evaluated for next-generation lithography solutions. While Toppan Printing is committed to supporting those developments, IBM has successfully developed a technology roadmap for ArF immersion lithography, a current mainstream technology that allows its extension to the 14-nm generation through the use of IBM’s highly regarded resolution enhancement techniques. As a result, Toppan and IBM will focus their joint development efforts on ArF immersion lithography for the 14-nm node,'' according to Toppan.

''The 14-nm logic technology node is likely to be the final node capable of being produced with optical lithography alone, and may prove to be an early transition point into EUV development. Future nodes are expected to deploy EUV lithography in order to print features beyond the diffraction limit associated with 193-nm lithography,'' according to Toppan.

ERJ-PA2D4320X_Datasheet PDF

This new agreement represents the continuation of a partnership that began in 2005 with 45-nm photomask process development, and has progressed through the 32-nm, 28-nm, 22-nm, and 20-nm technology nodes. The jointly developed photomask manufacturing processes have been essential contributors to advanced wafer process development by IBM and its partners in East Fishkill and Albany, NY.

The rugged board is available as 1553 only, 429 only, or fully populated with 1553/429 Multi-I/O. The latter saves space, power, weight, and cost in applications that need both MIL-STD-1553 and ARINC 429.

The Small Form Factor with USB 2.0 Interface is well-suited for:

For more information visit www.ddc-web.com/Products/233/Default.aspx.

SAN JOSE, Calif. – The DRAM market is down-again.

Taiwan's DRAM makers survived the last downturn. This time around, the island's vendors may run out of luck.     

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