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The PC302 picoXcell SOC implements a complete HSPA+ access point that is compliant with Release 8 specifications for femtocells. It is built using an advanced 65nm manufacturing process to deliver the lowest cost and power for a femtocell available today.

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The PC302 picoXcell SOC implements a complete HSPA+ access point that is compliant with Release 8 specifications for femtocells. It is built using an advanced 65nm manufacturing process to deliver the lowest cost and power for a femtocell available today.

Vast's executive managment team, including president and CEO Alain Labat, will not be joining Synopsys as part of the acquisition, according to a Synopsys spokesperson.

Vast (Sunnyvale, Calif.) maintains partnerships to deliver system and processor models to several electronics suppliers and OEMs, including NEC, Renesas, Delphi and Infineon. In 2008, IBM Japan announced it would be jointly promoting Vast's electronics device virtualization for its major manufacturing customers in automotive and digital consumer electronics industries. Vast later announced similar deals with other firms, including Freescale Semiconductor.

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Early last year NEC Electronics Corp.'s U.S. subsidiary agreed to distribute Vast virtualization technology with automotive microcontrollers. Vast executives likened that deal to the relationship between Microsoft and IBM at the beginning of the PC boom.

PARIS — Molex announced the iPass+ High-Speed Channel (HSC) pluggable CXP copper and optical interconnect system, enabling 12 channels of 10 Gbps data, for up to 120 Gbps of total bandwidth.

The iPass+ CXP provides both copper and optical direct attach options for the same system port, thereby increasing the flexibility of system-level hardware for end users.

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This dual paddle-card system was adopted as the InfiniBand Architecture Specification Vol. 2 Release 1.2.1; Annex A6 in September 2009.

The unitary press-fit connector and cage assembly provides one-step placement to the host board and is offered in both single and stacked dual-port configurations.

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Molex CXP 12X direct attach copper cables are designed to accommodate single, ganged or stacked connector configurations in extremely high-density requirements. CXP passive copper cables are available in a variety of lengths.

Molex is developing optical CXP solutions with AOC (active optical cables) pluggable optical module cable assemblies and loopbacks. Cabling options for CXP optical products include 24-fibre round OFNP (Optical Fibre Nonconductive Plenum) rated jackets in 3.8 and 5.4mm diameters filling both shorter rack-to-rack and longer riser cabling requirements.

In addition to building and enhancing its R&D centers, Exide has added 60 science and engineering professionals – 40 positions in Milton alone – in design, process engineering, metals, carbons, ceramics and polymers and other disciplines.

The Exide Global RD&E organization is dedicated to utilizing battery chemistries, including lead-acid, lithium ion and technologies across applications to maximize performance and accelerate the global growth of new products across multiple product lines and businesses. Specifically the organization is focused on engineering and product development in emerging renewable energy (solar and wind) with large storage applications as well as the development of batteries for HEV applications.

In lead-acid chemistry alone, Exide is exploring many areas, including improvements to Exide's spiral-wound technology and lead-carbon hybrid batteries; alternative electrode compositions, structures, substrates; and improvements to gel technology for solar power energy storage.

Exide announced in summer 2009 that it was awarded $34.3 million in federal funding under the American Recovery and Reinvestment Act of 2009 for its proposal for the domestic manufacture of affordable lead-acid batteries incorporating advanced carbon technology. Exide's project involves two of its global technologies: a spiral wound absorbed glass mat (AGM) design and a flat plate AGM design.

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