WESTLAKE VILLAGE, Calif.–Eleven-month-old Inphi Corp. here claimed to be the first to develop indium-phosphide (InP) integrated circuits for commercial optical networking applications using data transmission speeds over 50 gigabits per second.

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WESTLAKE VILLAGE, Calif.–Eleven-month-old Inphi Corp. here claimed to be the first to develop indium-phosphide (InP) integrated circuits for commercial optical networking applications using data transmission speeds over 50 gigabits per second.

ATV06B100JB-HF_Datasheet PDF

WESTLAKE VILLAGE, Calif.–Eleven-month-old Inphi Corp. here claimed to be the first to develop indium-phosphide (InP) integrated circuits for commercial optical networking applications using data transmission speeds over 50 gigabits per second.

Call (408) 744-9040www.thinkSRS.comWescon Booth 623 EETInfo No. 626

SAN DIEGO — Qualcomm Inc. today announced production shipment of its high-end chip set for third-generation (3G) handsets, including features for advanced location capabilities.

ATV06B100JB-HF_Datasheet PDF

The San Diego-based supplier of code division multiple access (CDMA) technology also claimed that more than 50 system products are in development using its MSM5100 chip set and software, with some 3G handsets expected to be launched by year's end.

The Mobile Station Modem 5100 chip set combines Qualcomm's Wireless Internet Launchpad applications with the company's 3G CDMA2000 1X technology. The MSM5100 chip set is capable of supporting up to 307 kilobits per second (kbps) in the forward link, according to Qualcomm. And the MSM5100 supports the emergency Enhanced 911 (E911) service, which has been mandated by the U.S. Federal Communications Commission (FCC) within the next year, said Qualcomm.

The company also said the MSM5100 chip set and software solution will enable a broad range of future 3G global positioning system (GPS) services, including navigation information, area-specific weather forecasts, traffic reports and commercial tracking services.

ATV06B100JB-HF_Datasheet PDF

Qualcomm and more than a handful of chip-set competitors are racing each other to expand the features of 3G handsets and networks as third-generation services begin to emerge. A major concern in new cellular phones has been delays in implementing E911 technologies. Some companies–including Qualcomm–claim that competing chip sets do not meet the rigid E911 specifications, putting the entire concept of enhanced emergency services at risk (see July 10 story).

Brea, Calif. – The surface-mount, single-digit BS-C27 LED displays from American Bright have a flat-pad design with an internal connection that eliminates the need for leads. The leadless design allows for automatic pick-and-place insertion, reducing the time and assembly costs associated with hand placement, the company said. Four millimeters thick with a character height of 7 mm, the displays target compact devices such as cell phones, pagers and mobile communications gear. They come in an array of colors including superbright red, green, yellow and orange, and start at less than $1 each in large quantities.

ATV06B100JB-HF_Datasheet PDF

Call (888) 533-0800www.americanbrightled.comWescon Booth 1118 EETInfo No. 628

Smyrna, Ga. – Murata Electronics North America has rolled out two series of surface-mountable common-mode choke coils. Though small in size, the DLW21S series and the DLP31D series offer electromagnetic interference (EMI) filtering solutions for high-speed interfaces such as Universal Serial Bus, IEEE1394 (FireWire) and low-voltage differential signaling.

The company has already demonstrated an 8-Tops, 20-watt device. Using conventional DSPs to get that performance,” said Levy, you would need 6,600 devices, thereby requiring 26,400 cm2 of board space and 3,300 W. FPGAs would need 40 devices and 200 W, while ASICs would need 21 devices and 133 W.” As for pricing, Levy claims the ODSPE comes in at 1,000th that of current DSPs, again for the same performance level.

The very nature of the ODSPE's operation, combined with its high processing speed, will also allow designers to operate at a much higher level of abstraction to greatly accelerate the migration from basic research to product development, Levy said.

Their technology is one of the most exciting developments I've seen in a while,” said Will Strauss, president of Forward Concepts (Tempe, Ariz.). If they can do what they say they can do, they could force everyone to reevaluate the potential of their own technologies going forward.”

Lenslet is targeting a market that it believes is one of the fastest-growing in the industry. The Semiconductor Industry Association predicts that the DSP market will start rising again in 2002 at a rate of 30 percent to reach $6 billion,” said Levy. By 2004 the SIA sees it reaching $10 billion. This after a disastrous 2001 period in which the market is projected to drop 26 percent.

Lenslet's core competence is the processing of transforms such as fast Fourier transforms/inverse fast Fourier transforms (FFTs)/(IFFTs), discrete cosine transform (DCT), discrete Fourier transform (DFT), compression, vector-matrix multiplication, equalization and correlation, all of which are essential functions at the baseband level of most communications technologies — and are the ones that demand the most processing power,” said Levy.

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